With the high development of electronic industry, the tendency of lightweight has been put on agenda. 

Conventional materials such as Kovar, Titanium, Copper have different problems when used in electronic packaging.
• As one of the most common electronic packaging material, Kovar are widely in electronic packaging field.  Although the CTE of Kovar is low, but the weight is too heavy and the thermal conductitivity is much lower than other materials.
•Copper has high thermal conductivity, but the weight is too big to meet the requirement of lightweight of components;

•AlSiC is also a new type electronic packaging material, although it has low CTE, light weight, its too hard to be machined and plated.

As a controlled expansion alloy, AlSi alloys has been regarded to be the alternative to Kovar, AlSiC, Cu, Cu-W, Cu-Mo. AlSi alloys is the lightest thermal management and electronic packaging material.
Baienwei adopts rapid solidification technology specializing in high performance AlSi alloys. Due to the low CTE, low density, high thermal conductivity, Baienwei AlSi alloys are widely used in the electronic packaging for RF/microwave, defense, aerospace, optoelectronics, telecommunication etc.

 Baienwei offers:
•electronic packaging housings
•carriers
•lids and covers
•substrate
•header
•modules